Analysis on the Causes of Roughness of Copper Plating on PCB

PCB processing circuit board copper table rough problem analysis, the possible reasons are as follows:

PCB copper plating slot itself

As shown in Figure 1, the anode problem: improper composition of lead to produce impurities

2, gloss agent problem (decomposition, etc.)

3, the current density caused by improper copper surface uneven

4, tank composition disorders or impurities pollution

5, equipment design or improper assembly lead to poor current distribution

Of course, as a PCB copper itself in terms of the above problems lead to rough the possibility of no major pre-process problems

PTH process into other impurities:

1, the activation component of the misalignment of palladium concentration is too high or prepreg salt residue plate

2, the speed of the sluggish plate and PCB copper is residual tin ions

3, chemical copper sluggish plate and copper uneven

4, PCB copper plating before the improper picking lead to residual impurities black hole process:

Microcracking does not cause residual carbon

Improper oxidation caused poor board

Poor drying can lead to micro-corrosion can not be stripped of carbon black plate lead to residual carbon

Current input and output caused by improper board bad ,,,

The The general board rough rough PCB copper itself is the problem; the second is the source of pollution into the third is the personnel operation errors in addition to the material itself if bad (such as rough: residual glue, etc.) will lead to.