Do you know what the composition of the printed circuit board is?

Do you know what the composition of the printed circuit board is?

The current circuit board, mainly composed of the following

Line and surface (mode): the line is used as a tool between the original switch, the design will be designed in addition to the copper surface as the ground and the power line and the plane is made at the same time.

Dielectric layer (dielectric): used to maintain the insulation between the lines and layers, commonly known as the substrate.

Hole (Through Hole / Through Hole): The via hole allows two or more lines to turn on each other, the larger vias are part inserts, and the non-vias (nPTH) are usually used as surface patches Set the position, the assembly of fixed screws.

Solder resistant (Solder resistant / Solder Mask): not all of the copper surface to eat tin parts, so non-tin area, will be printed with a layer of copper to eat tin (usually epoxy), to avoid A short circuit between tin and tin. According to different processes, divided into green oil, red oil, blue oil.

Silkscreen (Legend / Marking / Silkscreen): This is a non-essential component. The main function is to mark the name of the parts on the circuit board, and to facilitate the assembly and maintenance.

Surface treatment (surface treatment): As the copper surface in the general environment, it is easy to oxidation, resulting in tin can not (poor solder), so will eat tin in the copper surface to protect. Protection methods are sprayed tin (HASL), gold (ENIG), silver (silver), tin (immersion tin), organic solder (OSP), the method has its own advantages and disadvantages, collectively referred to as surface treatment.