The technical difficulty of breaking single - sided circuit board in welding technology

The technical difficulty of breaking single - sided circuit board in welding technology

Single-sided circuit board with high precision, high flexibility characteristics, in which the module structure design system can be completely customized according to the special production of consumers, and can be upgraded to meet the needs of future development of electronic products.

Circuit board in the selective welding technology still has technical difficulties, more and more developers began to look to the choice of welding, single-sided circuit board in the welding process to select all the solder joints, welding at the same time not only to reduce costs Purpose, but also to overcome the reflow temperature sensitive components of the impact.

Compared with the wave soldering characteristics, you can understand the selective welding process. The most obvious difference between the two lies in the lower part of the wave soldering circuit board is completely immersed in the liquid solder, selective welding, only a part of the specific area of the solder wave contact. The circuit board itself is a poor heat transfer medium, welded, it does not heat the adjacent parts of the solder joint and circuit board area. It must also be precoated with solder before welding. Compared with the wave soldering, only the lower part of the circuit board to be welded part, rather than the entire circuit board flux coating. In addition, selective welding is only applicable to the welding box assembly. Selective soldering is a new method of selective soldering processes and equipment that is necessary for a thorough understanding of successful welding.

A typical selective soldering process, the flux spray circuit board preheat, dip, and drag welding.