Definition of HDI circuit boards

Definition of HDI circuit boards

HDI printed circuit board, fully meet the electronic products to achieve miniaturization, lightweight, thin requirements, is a conventional multi-layer PCB manufacturing technology, a major change.HDI printed circuit board manufacturing technology not only include buried, blind Hole manufacturing, such as laser drilling, photo-forming holes, plasma etching holes and other hole technology and electrical interconnection technology, and the emergence of a number of new substrate materials (such as resin foil) and coating materials, At the same time in the product processing equipment, positioning systems, product testing, and so have a new development.

HDI PCBs are known in Japan as build-up multi layers (BUM). It has a variety of methods such as SLC (surface laminar circuit) using photofluorescence method; CLLAVIS (CMK laminated multi-laser through-hole system) technology with coated copper foil and laser drilling; To achieve electrical interconnection ALIVH (any layer of through-hole) technology and Bz it (buried welding interconnect technology) technology.

Definition of HDI circuit boards

American PCB industry in April 1994 to form a cooperative community ITRI (Internet Technology Institute).

In September the same year to start high-density circuit board production research, especially for the October project

Has used Motorola's test model MTV1 and MRTV2.2 (1996.6)

The use of non-drilling method for the production of miniature blind holes, such as laser burning hole laser ablation photosensitive hole into the photo-Via, plasma etching hole plasma etching and alkaline etching holes and other methods to complete the sample, and quality and reliable assessment.

1997.7.15 published Microvia assessment of the tenth issue of the first phase of the report, so the formal launch of "high-density Internet HDI" a new era.

Definition of HDI

Where the non-mechanical drilling, the resulting aperture of 0.15mm (6mil) below (most of the blind hole), hole ring (ring ring or pad or land) in the diameter of 0.25mm (10mil) below, especially Microvia micro Guide holes or micropores.

Where the PCB has micropores, and the contact (connection) density of 130 points / inch 2 or more, wiring density (channel for the 50Mil) in 117 inches / inch 2 or more, known as HDI class PCB, the line width / spacing 3mil / 3mil or finer and narrower

This high-density interconnect is in fact different from the establishment of earlier processes, and the difference between the two is the main difference between traditional and traditional PCBs.

After the past few years of trial, four non-drilling method, the laser into the hole has become the mainstream. Carbon dioxide laser produced in the micro-blind hole of more than 5 mils, YAG laser is used for 3mil below the packaging board (substrate) in the field.

HDI market products

Depending on the characteristics of the product, the use of HDI micro-blind hole laminates can be divided into:

1, mobile phone phones, and notebook computers, the former hole book very thin and short as a function of the target, which is to strengthen the focus of the signal line quality, so the number of holes.

2, high-end computer and network communication and the surrounding large high-level board (14 layers above the high-level count) category, focusing on "signal integrity" (Signal Integrity) and strict characteristic impedance (Characteristic Impedance) control of the high function board Class as the target, the number of holes.

3, precision packaging board (packaging substrate), covering the line (Wine Board) and Flip Chip (Flip Chip) of the various precision carrier board (also known as interpolation or module board), L / S up to 2mil / 2mil aperture Only 1-2mil, the hole is also less than 5mil.HDI product examples ALIVH (any layer gap through hole)

This is a patented process for "Matsushita Electric Parts" (Matsushita Electric Parts), which is a collection of Poly-Aramid Thermrium staple paper, a high-functional epoxy resin, And then into the hole with the laser into the copper paste, and double-sided pressing copper and the line, that can be connected to the double-sided interconnection.

To complete the double-sided inner board, with the copper foil has been plugged film, and the outer copper, the three together from the complex laminated multilayer, due to the completion of a good rate than the successive layer method is better The

ALIVH existing

① standard ALVIH for mobile phone board, accounting for 60%, and more by Nokia, Ericaaon adopted

② ALIVH-B can be used for large-scale precision motherboard ③ ALIVH-FB can be used for a variety of very sophisticated packaging board (Substrate)

What is HDI

The printed circuit board is a structural element formed by insulating material and conductor wiring. When the final product is made, the integrated circuit, transistor, diode, passive element (such as resistance, capacitance, connection Etc.) and a variety of other electronic parts. Through the wire connected, you can form an electronic signal link and should be functional. Thus, a printed circuit board is a platform that provides a component link for receiving the base of the associated part.

As the printed circuit board is not a general terminal product, so the definition of the name is slightly confusing, for example: personal computer motherboard, called the motherboard and can not be directly called the circuit board, although the motherboard has a circuit board It is not the same, so the assessment of the industry when the two can not say the same and then for example: because there are integrated circuit parts loaded on the circuit board, so the news media called him IC board, but in essence he is not the same as printed circuit board.

In the electronic products tend to multi-functional complexity of the premise, the integrated circuit components of the contact distance is reduced, the signal transmission speed is relatively increased, followed by the increase in the number of wiring, the distance between the points Local shortening, which requires the application of high-density line configuration and micro-hole technology to achieve the goal. Wiring and bridging basically have the difficulty of achieving single and double panels, so the circuit board will be multi-layer, and because the signal line continues to increase, more power layer and ground layer for the design of the necessary means , All of which are more common from the Multilayer Printed Circuit Board.

For high-speed signal electrical requirements, the circuit board must provide AC impedance characteristics of the impedance control, high-frequency transmission capacity, reduce unnecessary radiation (EMI) and so on. The use of stripline, microstrip structure, multi-layer becomes the necessary design. In order to reduce the quality of signal transmission, will use low dielectric coefficient, low attenuation rate of insulating materials, in line with the electronic components of the miniaturization and array, the circuit board also continue to increase the density to meet the needs of BGA (ball Gate array), CSP (chip size package), DCA (direct chip accessories) and other components of the assembly of the emergence of more printed circuit board to an unprecedented high-density realm.

Where the diameter of less than 150um hole in the industry known as the microporous (micro-hole), the use of this geometry of the micro-geometry of the circuit can improve the assembly, space utilization and so on the benefits of electronic products for small Also has its necessity.

For such a structure of the circuit board products, the industry has had a number of different names to call such a circuit board For example: Europe and the United States industry because the production process is the use of sequential construction, so this kind of product called SBU (Sequence construction process), generally translated as "sequence by layer method", as the Japanese industry, because such products produced by the hole structure than the previous hole is much smaller, so that the production of such products For the MVP (Micro Via Process), generally translated as "micro-process", but also because the traditional multi-layer board known as the MLB (Multilayer Board), so call this type of circuit board BUM (the establishment of multi-layer board) General translation for the "increased layer of multi-layer board."

The IPC circuit board association of the United States, in order to avoid confusion, proposed that these products be referred to as the generic name of HDI (High Density Intrerconnection Technology), and if direct translation becomes a high-density link technology. But this can not reflect the characteristics of the circuit board, so most of the circuit board industry will be such products as HDI board or the entire Chinese name "high-density interconnect technology." But because of the smooth language of the problem, some people directly call this kind of product as "high-density circuit board" or HDI board.