What should we do to improve the electronic circuit boards

In recent years, we have vigorously promoted lead-free assembly process, because different high temperature solder has been used to make the whole operation environment change. The biggest problem with soldering so far is that the high temperature, high surface tension and the unmatched flux of the solder make it useless for traditional use of tin lead systems. Many parts, high density packaging when using disposable assembly process are faced with the problem of the operational tolerance narrower, how to promote electronics circuit board welding yield except to develop better help welding system, adjust the soldering temperature and time of operation is still the important topic.

Q: there are several processes in circuit board making that use gold, silver and palladium. How to release the precious metal from activated carbon and recycle it by electrolysis?

Answer: the circuit board is applied to all three metals at present, gold has gold finger plating, full plate gold plating, whole plate leaching gold, terminal electroplating and other applications. Silver currently has a partial application on the final surface of the circuit board. Palladium is used in chemical nickel and chemical copper activators.

The purpose of activated carbon absorption is to absorb organic matter, so precious metals will be absorbed. But there is no metal release method, and the only way to recover is to burn the carbon completely. This is also why similar gold-plated grooves of precious metals are transported directly to recovery without making activated carbon. Therefore, the electrolysis recovery is not feasible. The above is for your reference.

Why is it important for the circuit board soldering temperature and operation time for circuit board welding?

A: the basic parameters of the circuit board welding operation are the operating time and the operating temperature, especially the impregnating soldering method of printed circuit board. The solder temperature in the dip solder is above the melting temperature of the solder, and the solder time is the time for solder, substrate and melt solder. Dipping solder electrode, terminal in order to prevent line fusion food or parts damaged, but also in order to reduce the effects of homework high fever of parts, are expected to try to reduce the operating temperature of the solder will certainly try to shorten the time of the solder. However, the solder time and temperature can directly affect the solder and therefore set the necessary minimum operating conditions. Proper soldering temperature and time of operation depends on the composition of the solder is different, the kinds of weld metal, parts shape, surface state, construct density differences are all influencing factors, such as general use tin lead circuit boards welding fusion gold, compare standard dip soldering conditions for:

Solder temperature: 240-255 +2 degrees

Solder time: 2-3 seconds

But in the face of different parts, soldering temperature and time setting proper collocation and must be adjusted, some of the time for the sake of grain output and equipment dynamic rate on temperature, time will also lower limit set.